M.Sc. Mark Sippel

Bild von Mark Sippel

Signalintegrität, Materialcharakterisierung und Test

Cauerstr. 6
91058 Erlangen

Weitere Informationen zur Person und Lehrveranstaltungen.

Neueste Veröffentlichungen
M. Sippel, K. Lomakin, G. Gold, T. Reitberger, S. Neermann and K. Helmreich, “Simple Approach for brief RF Characterization of thin 3D printable Dielectrics,” in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, Italy, May 2017.
M. Sippel, G. Gold and K. Helmreich, “Signal Propagation Properties of Anisotropic Conducting Polymers up to 110 GHz and their Applicability in Test Fixtures,” in Proceedings of the 20th IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 2016.

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